GATE DIELECTRICS
Gate dielectrics form an important field of applications for ALD.
Intel has
recently announced that their 45 nm generation processors will include a
high-k HfO2 gate dielectric made by ALD.
There are various reasons that ALD has become the method of choice (see this
review): Unlike ALD, conventional evaporated films
suffer from porosity and sputtering creates defects in the sensitive silicon surface layer.
In addition, ALD guarantees extremely uniform and reproducible thickness, low stress, uniform stoichiometry, amorphous structure and
low defect density. Besides the industrial silicon platforms, ALD has proven essential to
create
gate dielectrics on device substrates without native oxides, such as high mobility
GaAs/AlGaAs heterostructures, organic transistors, nanotubes and many more.
Examples of materials include HfO2, ZrO2, Al2O3, LaAlO,
GdScO3, their nanolaminates, and others.