Electronics
As a low-cost, thin film deposition technique, ALD is capable of depositing flexible, multi-functional materials at low deposition temperatures. With excellent electrical, optical and encapsulation properties, these materials are perfectly suited for integration into flexible electronics, displays and sensors, including:
- Encapsulation barriers
- Diffusion barriers
- DRAM
- Etch resistance
- Gate dielectrics
- Gate electrodes
- Hydro-phobic/anti-stiction
- Magnetic heads
- MEMs and NEMs
- Metal interconnects
- Multi-layer capacitors
- RFID