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ANTI STICK

The number of applications for atomic layer deposition is growing rapidly. Chemists have synthesized exciting new precursors for a large variety of coating materials, and more and more films deposited with older deposition techniques such as evaporation, sputtering and chemical vapor deposition are being replaced by ALD. New markets now take advantage of the unique 100% conformality in and around 3D objects and the ease of large batch manufacturing while maintaining coating uniformity, reproducibility, strong adhesion and low stress. To learn more about the advantages for specific applications, browse the menu on the left and select your application.

ALD is suitable for many applications in Semiconductors and nanoelectronics including Gate Dielectrics, Gate Electrodes, Diffusion Barriers, and DRAM | Dynamic Random Access Memory. In the optical fields, ALD can be applied to Optical Dielectric Multilayer Structures / Filters, OLED (Organic Light Emitting Diode), Photonic Crystals and static Photonic Band Tuning, Transparent Conductors and Transparent Conducting Electrodes, TFEL or Thin Film Electroluminesence, Solar Cells, OLED Humidity Barrier, Precision Optics Coatings and Photonic Crystal Structures and Lasers. ALD is also applied to MEMS (micro electromechanical systems and Hydrophic & Anti-Stiction Layers in MEMS Devices. There are also applications of ALD in wear resistence, in coatings for blade edges and Nanocomposite Tungsten Disulphide solid lubricants. ALD is also used in nanostructures such as nanotubes & nanowires, and Atomic Force Microscope (AFM) tips. Other common applications of ALD are Catalysis & Catalyst Supports, Solid Oxide Fuel Cell Electrodes, Nano Glue, Biocompatible Coatings for medical instruments Ferromagnetic Transition Metals & Nanotubes and Internal Tube Liners and Inert Inner Linings.