ATOMIC LAYER DEPOSITION ADVANTAGES

1. Digital thickness control to atomic level (no rate monitor needed, just set the number of atomic layers).
2. Perfect 3D conformality, 100% step coverage: uniform coatings on flat, inside porous and around particle samples.
3. Large area thickness uniformity.
4. Easy batch scalability (precursor sources are small and stacking of substrates is possible).
5. Pinhole free films, even over very large areas.
6. Excellent repeatability (wide process windows: ALD is not sensitive to temperature or precursor dose variations).
7. Low defect density.
8. Excellent adhesion due to chemical bonds at the first layer.
9. Digital control of sandwiches, heterostructures, nanolaminates, mixed oxides, graded index layers and doping.
10. Gentle deposition process for sensitive substrates, no plasma.
11. Low temperature deposition possible (RT-400C).
12. Atomically flat and smooth coating, copies shape of substrate perfectly.
13. Low stress because of molecular self assembly.
14. 100% film density guarantees ideal material properties (n, Ebd, k, etc).
15. Insensitive to dust (grows underneath dust!).
16. Oxides, nitrides, metals, semiconductors possible (Cambridge NanoTech provides standard recipes).
17. Amorphous or crystalline depending on substrate and temperature.
18. Coats on everything, even on teflon.
19. High production yields due to all these process benefits.